- Fabricante:
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- CUI Devices (3)
- Jones Tech (1)
- Material:
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- Thickness:
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- Usage:
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- Adhesive:
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- Thermal Conductivity:
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4 Registros
Imagen | Parte | Fabricante | Descripción | MOQ | Valores | Acción | |
---|---|---|---|---|---|---|---|
CUI Devices | THERM PAD 50MMX50M... |
1 |
4
In-stock
|
Obtener cotización | |||
CUI Devices | SF60 THER INTERFA... |
1 |
50,000
In-stock
|
Obtener cotización | |||
CUI Devices | THERMAL INTERFAC... |
1 |
50,000
In-stock
|
Obtener cotización | |||
Jones Tech | CARBON FIBER FIL... |
1 |
50,000
In-stock
|
Obtener cotización |