- Fabricante：
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- Bergquist (1)
- Adhesive：
-
- Thermal Conductivity：
-
- Backing, Carrier：
-
- Thermal Resistivity：
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7 Registros
| Imagen | Parte | Fabricante | Descripción | MOQ | Valores | Acción | |
|---|---|---|---|---|---|---|---|
|
Laird Technologies - Thermal Materials | THERM PAD 31.75MMX3... |
1 |
1,043
In-stock
|
Obtener cotización | ||
|
|
Bergquist | THERM PAD 25.4MMX25... |
1 |
7,305
In-stock
|
Obtener cotización | ||
|
|
t-Global Technology | THERM PAD 25.4MMX25... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Laird Technologies - Thermal Materials | THERM PAD 25.4MMX25... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Laird Technologies - Thermal Materials | THERM PAD 31.75MMX3... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
t-Global Technology | THERM PAD 28.58MMX2... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
t-Global Technology | THERM PAD 31.75MMX3... |
1 |
50,000
In-stock
|
Obtener cotización |
