- Fabricante:
-
- Bergquist (2)
- Material:
-
- Adhesive:
-
- Thermal Conductivity:
-
- Outline:
-
- Backing, Carrier:
-
- Thermal Resistivity:
-
5 Registros
Imagen | Parte | Fabricante | Descripción | MOQ | Valores | Acción | |
---|---|---|---|---|---|---|---|
Bergquist | THERM PAD 25.4MMX19... |
1 |
18,680
In-stock
|
Obtener cotización | |||
Aavid, Thermal Division of Boyd Corporation | THERM PAD 19.05MMX1... |
1 |
50,000
In-stock
|
Obtener cotización | |||
Aavid, Thermal Division of Boyd Corporation | THERM PAD 19.05MMX1... |
1 |
50,000
In-stock
|
Obtener cotización | |||
Aavid, Thermal Division of Boyd Corporation | THERM PAD 21.84MMX1... |
1 |
50,000
In-stock
|
Obtener cotización | |||
Bergquist | THERM PAD 31.75MMX2... |
1 |
50,000
In-stock
|
Obtener cotización |