- Fabricante：
-
- Bergquist (1)
- Wakefield-Vette (2)
- Material：
-
- Usage：
-
- Thermal Conductivity：
-
- Backing, Carrier：
-
- Thermal Resistivity：
-
7 Registros
| Imagen | Parte | Fabricante | Descripción | MOQ | Valores | Acción | |
|---|---|---|---|---|---|---|---|
|
Laird Technologies - Thermal Materials | THERM PAD 31.75MMX3... |
1 |
1,043
In-stock
|
Obtener cotización | ||
|
|
Wakefield-Vette | THERM PAD RECT 1.2... |
1 |
174
In-stock
|
Obtener cotización | ||
|
|
Keystone Electronics | THERM PAD 31.75MMX3... |
1 |
473
In-stock
|
Obtener cotización | ||
|
|
t-Global Technology | THERM PAD 31.75MM X... |
1 |
2
In-stock
|
Obtener cotización | ||
|
|
Bergquist | THERM PAD 31.75MMX3... |
1 |
9,016
In-stock
|
Obtener cotización | ||
|
|
Laird Technologies - Thermal Materials | THERM PAD 31.75MMX3... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Wakefield-Vette | THERM PAD RECT 1.2... |
1 |
50,000
In-stock
|
Obtener cotización |
