- Fabricante:
-
- Bergquist (3)
- Product Status:
-
- Shape:
-
- Thermal Conductivity:
-
- Backing, Carrier:
-
10 Registros
Imagen | Parte | Fabricante | Descripción | MOQ | Valores | Acción | |
---|---|---|---|---|---|---|---|
Bergquist | THERM PAD 406.4MMX2... |
1 |
168
In-stock
|
Obtener cotización | |||
Laird Technologies - Thermal Materials | THERM PAD 228.6MMX2... |
1 |
2
In-stock
|
Obtener cotización | |||
Laird Technologies - Thermal Materials | THERM PAD 228.6MMX2... |
1 |
50,000
In-stock
|
Obtener cotización | |||
Laird Technologies - Thermal Materials | THERM PAD 228.6MMX2... |
1 |
50,000
In-stock
|
Obtener cotización | |||
Bergquist | THERM PAD 406.4MMX2... |
1 |
50,000
In-stock
|
Obtener cotización | |||
Laird Technologies - Thermal Materials | TFLEX HD3100 DC1 18X... |
1 |
50,000
In-stock
|
Obtener cotización | |||
Laird Technologies - Thermal Materials | THERM PAD 457.2MMX4... |
1 |
50,000
In-stock
|
Obtener cotización | |||
Bergquist | THERM PAD 406.4MMX2... |
1 |
50,000
In-stock
|
Obtener cotización | |||
Laird Technologies - Thermal Materials | THERM PAD 228.6MMX2... |
1 |
35
In-stock
|
Obtener cotización | |||
Laird Technologies - Thermal Materials | THERM PAD 228.6MMX2... |
1 |
50,000
In-stock
|
Obtener cotización |