- Fabricante:
-
- Parker Chomerics (9)
- Adhesive:
-
- Thermal Conductivity:
-
- Backing, Carrier:
-
11 Registros
Imagen | Parte | Fabricante | Descripción | MOQ | Valores | Acción | |
---|---|---|---|---|---|---|---|
Parker Chomerics | CHO-THERM T500 TO-2... |
1 |
500
In-stock
|
Obtener cotización | |||
Parker Chomerics | CHO-THERM 1674 TO-22... |
1 |
1,451
In-stock
|
Obtener cotización | |||
Parker Chomerics | CHO-THERM 1671 TO-22... |
1 |
211
In-stock
|
Obtener cotización | |||
Parker Chomerics | CHO-THERM 1674 TO-22... |
1 |
901
In-stock
|
Obtener cotización | |||
Parker Chomerics | CHO-THERM T441 TO-2... |
1 |
720
In-stock
|
Obtener cotización | |||
Laird Technologies - Thermal Materials | THERM PAD 19.05MMX1... |
1 |
420
In-stock
|
Obtener cotización | |||
Parker Chomerics | CHO-THERM T500 TO-2... |
1 |
50,000
In-stock
|
Obtener cotización | |||
Parker Chomerics | CHO-THERM T441 TO-2... |
1 |
50,000
In-stock
|
Obtener cotización | |||
Parker Chomerics | CHO-THERM 1674 0.010" ... |
1 |
31
In-stock
|
Obtener cotización | |||
Laird Technologies - Thermal Materials | THERM PAD 19.05MMX1... |
1 |
50,000
In-stock
|
Obtener cotización | |||
Parker Chomerics | CHO-THERM 1671 TO-22... |
1 |
50,000
In-stock
|
Obtener cotización |