- Fabricante：
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- Material：
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- Thickness：
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- Thermal Conductivity：
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- Outline：
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- Backing, Carrier：
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7 Registros
| Imagen | Parte | Fabricante | Descripción | MOQ | Valores | Acción | |
|---|---|---|---|---|---|---|---|
|
Aavid, Thermal Division of Boyd Corporation | HEATSINK |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Aavid, Thermal Division of Boyd Corporation | HEATSINK |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Aavid, Thermal Division of Boyd Corporation | HEATSINK |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Aavid, Thermal Division of Boyd Corporation | HEATSINK |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Aavid, Thermal Division of Boyd Corporation | THERM PAD W/ADH |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Laird Technologies - Thermal Materials | THERM PAD 41.91MMX2... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Laird Technologies - Thermal Materials | TGARD TNC-4 |
1 |
50,000
In-stock
|
Obtener cotización |
