- Fabricante：
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- Material：
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- Usage：
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- Adhesive：
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- Backing, Carrier：
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- Thermal Resistivity：
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5 Registros
| Imagen | Parte | Fabricante | Descripción | MOQ | Valores | Acción | |
|---|---|---|---|---|---|---|---|
|
Laird Technologies - Thermal Materials | THERM PAD 41.91MMX2... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Laird Technologies - Thermal Materials | THERM PAD 39.62MMX2... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Laird Technologies - Thermal Materials | THERM PAD 63.5MMX50... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
3G Shielding Specialties LP | THERMAL INTERFAC... |
1 |
17
In-stock
|
Obtener cotización | ||
|
|
3G Shielding Specialties LP | THERMAL INTERFAC... |
1 |
12
In-stock
|
Obtener cotización |
