- Fabricante：
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- Würth Elektronik (5)
- CUI Devices (6)
- Parker Chomerics (1)
- t-Global Technology (20)
- Wakefield-Vette (1)
- Product Status：
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- Material：
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- Type：
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- Thickness：
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- Usage：
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- Adhesive：
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- Outline：
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- Backing, Carrier：
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- Thermal Resistivity：
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59 Registros
| Imagen | Parte | Fabricante | Descripción | MOQ | Valores | Acción | |
|---|---|---|---|---|---|---|---|
|
Laird Technologies - Thermal Materials | THERM PAD 457.2MMX3... |
1 |
647
In-stock
|
Obtener cotización | ||
|
|
Laird Technologies - Thermal Materials | THERM PAD 457.2MMX3... |
1 |
454
In-stock
|
Obtener cotización | ||
|
|
Laird Technologies - Thermal Materials | THERM PAD 457.2MMX3... |
1 |
462
In-stock
|
Obtener cotización | ||
|
|
Parker Chomerics | THERM-A-GAP G974 5W... |
1 |
8
In-stock
|
Obtener cotización | ||
|
|
Würth Elektronik | WE-TGF THERMAL GA... |
1 |
5
In-stock
|
Obtener cotización | ||
|
|
Würth Elektronik | WE-PCM PHASE CHAN... |
1 |
7
In-stock
|
Obtener cotización | ||
|
|
t-Global Technology | THERM PAD 120MMX90M... |
1 |
10
In-stock
|
Obtener cotización | ||
|
|
t-Global Technology | THERM PAD 120MMX90M... |
1 |
1
In-stock
|
Obtener cotización | ||
|
|
Würth Elektronik | WE-TGF THERMAL GA... |
1 |
18
In-stock
|
Obtener cotización | ||
|
|
Würth Elektronik | WE-TGF THERMAL GA... |
1 |
3
In-stock
|
Obtener cotización | ||
|
|
Laird Technologies - Thermal Materials | THERM PAD 34MMX30M... |
1 |
29
In-stock
|
Obtener cotización | ||
|
|
t-Global Technology | THERM PAD 288MMX192... |
1 |
9
In-stock
|
Obtener cotización | ||
|
|
Laird Technologies - Thermal Materials | THERM PAD 19.05MMX1... |
1 |
1
In-stock
|
Obtener cotización | ||
|
|
t-Global Technology | THERM PAD 120MMX90M... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Laird Technologies - Thermal Materials | THERM PAD 609.6MMX4... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Wakefield-Vette | ULTIMIFLUX 5.0W/MK... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
CUI Devices | THERMAL INTERFAC... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Laird Technologies - Thermal Materials | THERM PAD 584.2MMX4... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
CUI Devices | THERMAL INTERFAC... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
CUI Devices | THERMAL INTERFAC... |
1 |
50,000
In-stock
|
Obtener cotización |
