- Fabricante：
-
- Bergquist (3)
- Parker Chomerics (4)
- Material：
-
- Thickness：
-
- Adhesive：
-
- Thermal Conductivity：
-
- Outline：
-
- Backing, Carrier：
-
- Thermal Resistivity：
-
7 Registros
| Imagen | Parte | Fabricante | Descripción | MOQ | Valores | Acción | |
|---|---|---|---|---|---|---|---|
|
Parker Chomerics | CHO-THERM T500 TO-3... |
1 |
237
In-stock
|
Obtener cotización | ||
|
|
Bergquist | THERM PAD 45.21MMX3... |
1 |
2,986
In-stock
|
Obtener cotización | ||
|
|
Bergquist | THERM PAD 41.91MMX2... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Bergquist | THERM PAD 39.62MMX2... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Parker Chomerics | CHO-THERM T500 TO-6... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Parker Chomerics | CHO-THERM T500 TO-3... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Parker Chomerics | CHO-THERM T500 TO-6... |
1 |
50,000
In-stock
|
Obtener cotización |
