- Fabricante：
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- Würth Elektronik (2)
- Leader Tech Inc. (1)
- Material：
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- Shape：
-
- Adhesive：
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- Thermal Conductivity：
-
- Outline：
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- Backing, Carrier：
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- Thermal Resistivity：
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8 Registros
| Imagen | Parte | Fabricante | Descripción | MOQ | Valores | Acción | |
|---|---|---|---|---|---|---|---|
|
Shiu Li Technology Co., Ltd. | THERMAL PAD, SHEE... |
1 |
57
In-stock
|
Obtener cotización | ||
|
|
Würth Elektronik | WE-TGF THERMAL GA... |
1 |
40
In-stock
|
Obtener cotización | ||
|
|
Laird Technologies - Thermal Materials | TFLEX P320 18.00X18.00I... |
1 |
4
In-stock
|
Obtener cotización | ||
|
|
Leader Tech Inc. | THERM PAD 199.9MMX1... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Shiu Li Technology Co., Ltd. | THERMAL PAD, SHEE... |
1 |
52
In-stock
|
Obtener cotización | ||
|
|
Laird Technologies - Thermal Materials | TFLEX P320 9.00X9.00IN... |
1 |
21
In-stock
|
Obtener cotización | ||
|
|
t-Global Technology | TG-A4500 310X310X0.5MM |
1 |
10
In-stock
|
Obtener cotización | ||
|
|
Würth Elektronik | WE-TGF THERMAL GA... |
1 |
5
In-stock
|
Obtener cotización |
