- Fabricante：
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- Product Status：
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- Adhesive：
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- Thermal Conductivity：
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- Outline：
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- Backing, Carrier：
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7 Registros
| Imagen | Parte | Fabricante | Descripción | MOQ | Valores | Acción | |
|---|---|---|---|---|---|---|---|
|
Laird Technologies - Thermal Materials | TFLEX UT20200 18" X 18... |
1 |
4
In-stock
|
Obtener cotización | ||
|
|
Aavid, Thermal Division of Boyd Corporation | PAD SUPERTHERMAL... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Laird Technologies - Thermal Materials | THERM PAD 457.2MMX4... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Laird Technologies - Thermal Materials | THERM PAD 457.2MMX4... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Laird Technologies - Thermal Materials | TFLEX UT20200 9" X 9" |
1 |
32
In-stock
|
Obtener cotización | ||
|
|
Aavid, Thermal Division of Boyd Corporation | PAD SUPER D089 0.2MM... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Laird Technologies - Thermal Materials | THERM PAD 228.6MMX2... |
1 |
50,000
In-stock
|
Obtener cotización |
