- Fabricante：
-
- Bergquist (2)
- Material：
-
- Usage：
-
- Adhesive：
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- Thermal Conductivity：
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- Backing, Carrier：
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- Thermal Resistivity：
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13 Registros
| Imagen | Parte | Fabricante | Descripción | MOQ | Valores | Acción | |
|---|---|---|---|---|---|---|---|
|
t-Global Technology | THERM PAD 19.05MMX1... |
1 |
143
In-stock
|
Obtener cotización | ||
|
|
t-Global Technology | THERM PAD 19.05MMX1... |
1 |
85
In-stock
|
Obtener cotización | ||
|
|
t-Global Technology | THERM PAD 19.05MMX1... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
t-Global Technology | THERM PAD 19.05MMX1... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
t-Global Technology | THERM PAD 19.05MMX1... |
1 |
50
In-stock
|
Obtener cotización | ||
|
|
t-Global Technology | THERM PAD 19.05MMX1... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Laird Technologies - Thermal Materials | THERM PAD 19.05MMX1... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Bergquist | THERM PAD 19.05MMX1... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Bergquist | THERM PAD 19.05MMX1... |
1 |
20,289
In-stock
|
Obtener cotización | ||
|
|
Laird Technologies - Thermal Materials | THERM PAD 19.05MMX1... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Laird Technologies - Thermal Materials | THERM PAD 19.05MMX1... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Laird Technologies - Thermal Materials | THERM PAD 19.05MMX1... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Shiu Li Technology Co., Ltd. | THERMAL PAD, SHEE... |
1 |
50,000
In-stock
|
Obtener cotización |
