- Fabricante:
-
- Bergquist (1)
- Material:
-
- Adhesive:
-
- Thermal Conductivity:
-
- Backing, Carrier:
-
- Thermal Resistivity:
-
4 Registros
Imagen | Parte | Fabricante | Descripción | MOQ | Valores | Acción | |
---|---|---|---|---|---|---|---|
Bergquist | THERM PAD 17.45MMX1... |
1 |
50,000
In-stock
|
Obtener cotización | |||
t-Global Technology | THERM PAD 17.45MMX1... |
1 |
50,000
In-stock
|
Obtener cotización | |||
t-Global Technology | THERM PAD 17.45MMX1... |
1 |
50,000
In-stock
|
Obtener cotización | |||
Laird Technologies - Thermal Materials | THERM PAD 17.45MMX1... |
1 |
50,000
In-stock
|
Obtener cotización |