- Fabricante:
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- Würth Elektronik (2)
- Leader Tech Inc. (1)
- Material:
-
- Shape:
-
- Outline:
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- Backing, Carrier:
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- Thermal Resistivity:
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9 Registros
Imagen | Parte | Fabricante | Descripción | MOQ | Valores | Acción | |
---|---|---|---|---|---|---|---|
Leader Tech Inc. | THERM PAD 199.9MMX1... |
1 |
100
In-stock
|
Obtener cotización | |||
Würth Elektronik | WE-TGF THERMAL GA... |
1 |
50,000
In-stock
|
Obtener cotización | |||
Laird Technologies - Thermal Materials | THERM PAD 406.4MMX4... |
1 |
50,000
In-stock
|
Obtener cotización | |||
Laird Technologies - Thermal Materials | THERM PAD 203.2MMX2... |
1 |
50,000
In-stock
|
Obtener cotización | |||
Laird Technologies - Thermal Materials | THERM PAD 203.2MMX2... |
1 |
50,000
In-stock
|
Obtener cotización | |||
Laird Technologies - Thermal Materials | GAP FILLER TPLI 2... |
1 |
50,000
In-stock
|
Obtener cotización | |||
Laird Technologies - Thermal Materials | THERM PAD 203.2MMX2... |
1 |
50,000
In-stock
|
Obtener cotización | |||
Shiu Li Technology Co., Ltd. | THERMAL PAD, SHEE... |
1 |
1
In-stock
|
Obtener cotización | |||
Würth Elektronik | WE-TGF THERMAL GA... |
1 |
4
In-stock
|
Obtener cotización |