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- Operating Temperature:
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- Package / Case:
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- Supplier Device Package:
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- Core Processor:
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- Number of Cores/Bus Width:
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- Co-Processors/DSP:
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- Display & Interface Controllers:
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- Security Features:
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9 Registros
Imagen | Parte | Fabricante | Descripción | MOQ | Valores | Acción | |
---|---|---|---|---|---|---|---|
Rochester Electronics, LLC | IC MICROPROCESSO... |
1 |
50,000
In-stock
|
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STMicroelectronics | ACCORDO2 DUAL COR... |
1 |
50,000
In-stock
|
Obtener cotización | |||
STMicroelectronics | TFBGA11SQX1.2 256 F1 |
1 |
50,000
In-stock
|
Obtener cotización | |||
STMicroelectronics | TFBGA11SQX1.2 256 F1 |
1 |
50,000
In-stock
|
Obtener cotización | |||
STMicroelectronics | TFBGA11SQX1.2 256 F1 |
1 |
50,000
In-stock
|
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STMicroelectronics | LFBGA16X16X1.7 361 F |
1 |
50,000
In-stock
|
Obtener cotización | |||
STMicroelectronics | LFBGA16X16X1.7 361 F |
1 |
50,000
In-stock
|
Obtener cotización | |||
STMicroelectronics | LFBGA16X16X1.7 361 F |
1 |
50,000
In-stock
|
Obtener cotización | |||
STMicroelectronics | LFBGA16X16X1.7 361 F |
1 |
50,000
In-stock
|
Obtener cotización |