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- Operating Temperature：
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- Package / Case：
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- Supplier Device Package：
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- Core Processor：
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- Number of Cores/Bus Width：
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- Co-Processors/DSP：
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- Display & Interface Controllers：
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- Security Features：
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8 Registros
| Imagen | Parte | Fabricante | Descripción | MOQ | Valores | Acción | |
|---|---|---|---|---|---|---|---|
|
Rochester Electronics, LLC | IC MICROPROCESSO... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
STMicroelectronics | ACCORDO2 DUAL COR... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
STMicroelectronics | TFBGA11SQX1.2 256 F1 |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
STMicroelectronics | TFBGA11SQX1.2 256 F1 |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
STMicroelectronics | LFBGA16X16X1.7 361 F |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
STMicroelectronics | LFBGA16X16X1.7 361 F |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
STMicroelectronics | LFBGA16X16X1.7 361 F |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
STMicroelectronics | LFBGA16X16X1.7 361 F |
1 |
50,000
In-stock
|
Obtener cotización |
