- Material：
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- Attachment Method：
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- Plating - Thickness：
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9 Registros
| Imagen | Parte | Fabricante | Descripción | MOQ | Valores | Acción | |
|---|---|---|---|---|---|---|---|
|
Laird Technologies EMI | RFI EMI GROUNDIN... |
1 |
1
In-stock
|
Obtener cotización | ||
|
|
Laird Technologies EMI | CSTR,COIL,NIB,CTL... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Laird Technologies EMI | FINGERSTOCK BECU... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Laird Technologies EMI | CSTR COIL BF USF |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Laird Technologies EMI | CSTR COIL ZNY |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Laird Technologies EMI | CSTR COIL SNB |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Laird Technologies EMI | CSTR COIL NIE |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Laird Technologies EMI | CSTR COIL NIB |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Laird Technologies EMI | CLO,STR,SNB,USFT |
1 |
50,000
In-stock
|
Obtener cotización |
