- Plating：
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- Attachment Method：
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- Plating - Thickness：
-
8 Registros
| Imagen | Parte | Fabricante | Descripción | MOQ | Valores | Acción | |
|---|---|---|---|---|---|---|---|
|
Laird Technologies EMI | RFI EMI GROUNDIN... |
1 |
1
In-stock
|
Obtener cotización | ||
|
|
Laird Technologies EMI | CSTR COIL SNB |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Laird Technologies EMI | CSTR,STR,BF |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Laird Technologies EMI | CSTR COIL BF USF |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Laird Technologies EMI | CSTR COIL SNB |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Laird Technologies EMI | CSTR COIL NIE |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Laird Technologies EMI | CSTR COIL NIB |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Laird Technologies EMI | CSTR COIL BF |
1 |
50,000
In-stock
|
Obtener cotización |
