32-6554-11

N.º de pieza del fabricante
32-6554-11
Fabricante
Aries Electronics
Paquete/Caso
-
Ficha de datos
Descargar
Descripción
CONN IC DIP SOCKET ZIF 32POS GLD
Valores:
En stock

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Fabricante :
Aries Electronics
categoria de producto :
Zócalos para circuitos integrados, transistores
Contact Finish - Mating :
Gold
Contact Finish - Post :
Gold
Contact Finish Thickness - Mating :
-
Contact Finish Thickness - Post :
-
Contact Material - Mating :
Beryllium Copper
Contact Material - Post :
Beryllium Copper
Features :
Closed Frame
Housing Material :
Polyphenylene Sulfide (PPS), Glass Filled
Mounting Type :
Through Hole
Number of Positions or Pins (Grid) :
32 (2 x 16)
Operating Temperature :
-
Pitch - Mating :
0.100" (2.54mm)
Pitch - Post :
0.100" (2.54mm)
Product Status :
Active
Termination :
Solder
Type :
DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Hojas de datos
32-6554-11

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