XR2A-0825

N.º de pieza del fabricante
XR2A-0825
Fabricante
Omron Electronics Inc-EMC Div
Paquete/Caso
-
Ficha de datos
Descargar
Descripción
CONN IC DIP SOCKET 8POS GOLD
Valores:
En stock

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Fabricante :
Omron Electronics Inc-EMC Div
categoria de producto :
Zócalos para circuitos integrados, transistores
Contact Finish - Mating :
Gold
Contact Finish - Post :
Gold
Contact Finish Thickness - Mating :
Flash
Contact Finish Thickness - Post :
Flash
Contact Material - Mating :
Beryllium Copper
Contact Material - Post :
Beryllium Copper
Features :
Open Frame
Housing Material :
Polybutylene Terephthalate (PBT), Glass Filled
Mounting Type :
Through Hole
Number of Positions or Pins (Grid) :
8 (2 x 4)
Operating Temperature :
-55°C ~ 125°C
Pitch - Mating :
0.100" (2.54mm)
Pitch - Post :
0.100" (2.54mm)
Product Status :
Active
Termination :
Solder
Type :
DIP, 0.3" (7.62mm) Row Spacing
Hojas de datos
XR2A-0825

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