HSB19-272718

Fabricante :

CUI Devices

categoria de producto :

Térmica - Disipadores de calor

Attachment Method :

Adhesive

Diameter :

-

Fin Height :

0.709" (18.00mm)

Length :

1.063" (27.00mm)

Material :

Aluminum Alloy

Material Finish :

Black Anodized

Package Cooled :

BGA

Power Dissipation @ Temperature Rise :

6.8W @ 75°C

Product Status :

Active

Shape :

Square, Pin Fins

Thermal Resistance @ Forced Air Flow :

4.50°C/W @ 200 LFM

Thermal Resistance @ Natural :

11.11°C/W

Type :

Top Mount

Width :

1.063" (27.00mm)