HSS-C2591-SMT-TR

Fabricante :

CUI Devices

categoria de producto :

Térmica - Disipadores de calor

Attachment Method :

-

Diameter :

-

Fin Height :

0.375" (9.52mm)

Length :

0.591" (15.00mm)

Material :

Copper

Material Finish :

Tin

Package Cooled :

TO-263 (D²Pak)

Power Dissipation @ Temperature Rise :

2.1W @ 75°C

Product Status :

Active

Shape :

Rectangular, Fins

Thermal Resistance @ Forced Air Flow :

8.15°C/W @ 200 LFM

Thermal Resistance @ Natural :

35.71°C/W

Type :

Top Mount

Width :

1.020" (25.91mm)