- Fabricante：
-
- Cooling Source (2)
- CUI Devices (1)
- Sarnikon (1)
- Material：
-
- Type：
-
- Attachment Method：
-
- Fin Height：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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4 Registros
| Imagen | Parte | Fabricante | Descripción | MOQ | Valores | Acción | |
|---|---|---|---|---|---|---|---|
|
Cooling Source | 28.5X28.5X10MM |
1 |
950
In-stock
|
Obtener cotización | ||
|
|
Sarnikon | TRANSISTOR HEATS... |
1 |
500
In-stock
|
Obtener cotización | ||
|
|
CUI Devices | HEAT SINK, BGA, 28.... |
1 |
1,728
In-stock
|
Obtener cotización | ||
|
|
Cooling Source | 28.5X28.5X10MM |
1 |
13
In-stock
|
Obtener cotización |
