- Fabricante：
-
- Comair Rotron (3)
- CUI Devices (2)
- Wakefield-Vette (1)
- Product Status：
-
- Type：
-
- Attachment Method：
-
- Fin Height：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
13 Registros
| Imagen | Parte | Fabricante | Descripción | MOQ | Valores | Acción | |
|---|---|---|---|---|---|---|---|
|
Assmann WSW Components | HEATSINK TO-263 12.7... |
1 |
2,257
In-stock
|
Obtener cotización | ||
|
|
Assmann WSW Components | HEATSINK TO-263 12.7... |
1 |
14,370
In-stock
|
Obtener cotización | ||
|
|
Advanced Thermal Solutions Inc. | HEATSINK TO-263 CO... |
1 |
8,604
In-stock
|
Obtener cotización | ||
|
|
Advanced Thermal Solutions Inc. | HEATSINK TO-263 CO... |
1 |
68,257
In-stock
|
Obtener cotización | ||
|
|
Aavid, Thermal Division of Boyd Corporation | TOP MOUNT HEATSI... |
1 |
13,140
In-stock
|
Obtener cotización | ||
|
|
Aavid, Thermal Division of Boyd Corporation | HEATSINK TO-263 (D2... |
1 |
6,052
In-stock
|
Obtener cotización | ||
|
|
Assmann WSW Components | HEATSINK TO-263 19.3... |
1 |
394
In-stock
|
Obtener cotización | ||
|
|
CUI Devices | HEAT SINK TO-263 CO... |
1 |
300
In-stock
|
Obtener cotización | ||
|
|
Comair Rotron | HEATSINK STAMP 26... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Comair Rotron | HEATSINK STAMP 19... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Comair Rotron | HEATSINK STAMP 25... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Wakefield-Vette | HEATSINK SMT PKG |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
CUI Devices | HEAT SINK TO-263 CO... |
1 |
50,000
In-stock
|
Obtener cotización |
