- Fabricante：
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- CUI Devices (1)
- Ohmite (1)
- Material：
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- Shape：
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- Width：
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- Length：
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- Attachment Method：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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19 Registros
