- Fabricante：
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- CUI Devices (2)
- Material：
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- Attachment Method：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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- Material Finish：
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8 Registros
| Imagen | Parte | Fabricante | Descripción | MOQ | Valores | Acción | |
|---|---|---|---|---|---|---|---|
|
Advanced Thermal Solutions Inc. | HEATSINK TO-220 AL... |
1 |
1,288
In-stock
|
Obtener cotización | ||
|
|
Advanced Thermal Solutions Inc. | HEAT SINK 23MM X 23... |
1 |
94
In-stock
|
Obtener cotización | ||
|
|
Advanced Thermal Solutions Inc. | HEAT SINK 23MM X 23... |
1 |
109
In-stock
|
Obtener cotización | ||
|
|
Advanced Thermal Solutions Inc. | 1/8 BRICK HEATSINK... |
1 |
190
In-stock
|
Obtener cotización | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Advanced Thermal Solutions Inc. | HEATSINK 23X23X12.5M... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Advanced Thermal Solutions Inc. | SUPERGRIP HEATSI... |
1 |
7
In-stock
|
Obtener cotización |
