- Fabricante：
-
- Comair Rotron (1)
- CUI Devices (1)
- Product Status：
-
- Type：
-
- Attachment Method：
-
- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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4 Registros
| Imagen | Parte | Fabricante | Descripción | MOQ | Valores | Acción | |
|---|---|---|---|---|---|---|---|
|
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
1 |
5,682
In-stock
|
Obtener cotización | ||
|
|
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Comair Rotron | HEATSINK STAMP 25... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
CUI Devices | HEAT SINK TO-263 CO... |
1 |
50,000
In-stock
|
Obtener cotización |
