- Material：
-
- Type：
-
- Thickness：
-
- Thermal Conductivity：
-
- Backing, Carrier：
-
- Thermal Resistivity：
-
13 Registros
| Imagen | Parte | Fabricante | Descripción | MOQ | Valores | Acción | |
|---|---|---|---|---|---|---|---|
|
Bergquist | THERM PAD 21.84MMX1... |
1 |
6,751
In-stock
|
Obtener cotización | ||
|
|
t-Global Technology | THERM PAD 21.84MMX1... |
1 |
196
In-stock
|
Obtener cotización | ||
|
|
3M (TC) | THERM PAD 21.84MMX1... |
1 |
273
In-stock
|
Obtener cotización | ||
|
|
t-Global Technology | THERM PAD 21.84MMX1... |
1 |
169
In-stock
|
Obtener cotización | ||
|
|
Bergquist | THERM PAD 21.84MMX1... |
1 |
46,794
In-stock
|
Obtener cotización | ||
|
|
t-Global Technology | THERM PAD 21.84MMX1... |
1 |
3,435
In-stock
|
Obtener cotización | ||
|
|
t-Global Technology | THERM PAD 21.84MMX1... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
t-Global Technology | THERM PAD 21.84MM X... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Laird Technologies - Thermal Materials | THERM PAD 21.84MMX1... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Bergquist | THERM PAD 21.84MMX1... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Laird Technologies - Thermal Materials | THERM PAD 21.84MMX1... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Laird Technologies - Thermal Materials | THERM PAD 21.84MMX1... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Laird Technologies - Thermal Materials | THERM PAD 21.84MMX1... |
1 |
50,000
In-stock
|
Obtener cotización |
