- Fabricante：
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- Material：
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- Thickness：
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- Adhesive：
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- Thermal Conductivity：
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- Backing, Carrier：
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8 Registros
| Imagen | Parte | Fabricante | Descripción | MOQ | Valores | Acción | |
|---|---|---|---|---|---|---|---|
|
t-Global Technology | THERM PAD 21.84MMX1... |
1 |
196
In-stock
|
Obtener cotización | ||
|
|
t-Global Technology | THERM PAD 21.84MMX1... |
1 |
169
In-stock
|
Obtener cotización | ||
|
|
t-Global Technology | THERM PAD 21.84MMX1... |
1 |
3,435
In-stock
|
Obtener cotización | ||
|
|
t-Global Technology | THERM PAD 21.84MMX1... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
t-Global Technology | THERM PAD 21.84MM X... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Laird Technologies - Thermal Materials | THERM PAD 21.84MMX1... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Laird Technologies - Thermal Materials | THERM PAD 21.84MMX1... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Laird Technologies - Thermal Materials | THERM PAD 21.84MMX1... |
1 |
50,000
In-stock
|
Obtener cotización |
